MacDermid Alpha Opens New Die Attach Applications Center in Zhongli District, Taoyuan City, Taiwan R.O.C

(West Haven, Connecticut, USA) – April 8th, 2021 – MacDermid Alpha Electronics Solutions, a global
leader in high performance electronics materials, officially opened a Greater China Die Attach
Application Center on April 1st, 2021. The advanced technology and application center will house
technical service and lab personnel, equipped with state-of-the-art die attach assembly and process

Rick Frick, Vice President and General Manager of the Semiconductor Solutions division, described the
new facility and its impact, “With MacDermid Alpha’s unique role as a leading packaging materials
supplier to all steps of the electronics manufacturing supply chain, this multi-million dollar investment to
build a leading edge applications center is an important next step in enabling our customers to meet
their design goals. With these new capabilities, we will foster not only local, but also regional
development of advanced Die Attach applications and high-volume manufacturing processes.
Additionally, the facility enables collaboration of MacDermid Alpha’s suite of technologies including IC
substrate processes, advanced assembly polymers, metals and fluxes and wafer metallization in a way
that optimizes every material within an electronic device.”

The applications center houses advanced die attach assembly and testing equipment for high volume
process optimization and the most advanced component designs using our innovative paste and film
products. The second floor also houses our panel level packaging applications laboratory with
capabilities for the testing of solder balls, micro solder spheres, reflow metrology, and a fully functional
tool for wafer level tin bumping. Production-scale wet processing equipment lines are located on the
third floor, along with a complete chemical analysis laboratory containing high-precision instruments for
comprehensive customer service.

Jack Mook, General Manager APAC, Semiconductor Solutions, further commented, “We are confident
through these investments and new capabilities that we can assist regional companies in achieving their
goals and allow new advancements in the semiconductor industry as a whole.”